ICDME 2019 Keynote Speakers

Prof. Xungai Wang

Deakin University, Australia 

Biography: Professor Wang is the Pro Vice-Chancellor (Future Fibres) at Deakin University, Australia. He also heads the ARC Research Hub for Future Fibres, and serves as the editor-in-chief for the Journal of the Textile Institute. Professor Wang holds a PhD in Fibre Science and Technology and a Graduate Diploma in Higher Education from the University of New South Wales. In 2005, he was awarded the US Fiber Society Distinguished Achievement Award. In 2006, he was named Alfred Deakin Professor, the highest Honour that Deakin University can bestow on a member of staff. He served as President of the Fiber Society in 2015.
Title of Speech: Recent Research in Fibre and Textile Materials
Abstract: This talk will introduce examples of recent research activities by researchers at Deakin University, supported by the ARC Research Hub for Future Fibres. The Hub is a major research collaboration between leading research organisations and local industry partners. The talk will also cover our research into several key properties of fibre materials. These properties are not only basic properties of a fibre, they also affect our daily lives. The challenges in measuring these properties are discussed, together with recent progress in the textile recycling area.

 

Prof. Yonggang Zhu

Harbin Institute of Technology - Shenzhen, China  

Biography: Professor Yonggang Zhu is currently a Professor and director of Center for Microflows and Nanoflows at Harbin Institute of Technology, ShenZhen, China, and Joint Professor at School of Science, RMIT University, Australia. Prior to this, he held the positions of Senior Principal Research Scientist and Research Team Leader for the Microfluidics and Fluid Dynamics Team in CSIRO Australia, Senior Technology Fellow at Melbourne Centre for Nanofabrication. His current research interests include micro- and nanoscale thermal & fluid flows, lab on a chip devices, microtheraml systems, multiphase flows and micro-sensors. He has led many research and development projects in developing advanced technologies for chemical and biological sensing, new materials development, thermal management systems and industry applications. Prof. Zhu has published over 200 papers including book chapters, journal articles, conference papers and technical reports. He is the winner of 2012 Australian Museum Eureka Science Prize for Outstanding Science in Support of Defence or National Security.
Title of Speech: Lab on a chip technolgies for biomedical applications
Abstract: The development of microfluidic lab on a chip technologies has attracted more and more attention since the last two decades for both fundamental research and applications. These applications include biosensors for sensing chemical and biological substances, organ on a chip for drug screening, medical diagnostics, biomaterials development and so on. This talk will report the developments of microfluidic devices for biosensing and organ on a chip applications. The first part will present the development of lab on a chip devices for the detection of chemical agents from collected raw samples in the field, Handra virus and cancer biomarkers. The key microflow control techniques such as magnetic microbeads trapping, magnetic and acoustic micromixing have been developed to enable the fast biochemical reactions. Detection of cancer biomarkers has been demonstrated with fast speed and high sensitivity. The second part of the talk will report the development of an alveolar microchip to investigation the chaotic flow pattern in alveoli and its effect on micro and nanoparticles transport deep in the lung.

 

Prof. Zhengyi Jiang

University of Wollongong, Australia 

Biography: Professor Zhengyi Jiang is currently Senior Professor and Leader of Advanced Micro Manufacturing Centre at the University of Wollongong (UOW). He has been carrying out research on rolling mechanics with over 28 years expertise in rolling theory and technology, tribology in metal manufacturing, contact mechanics and computational mechanics in metal manufacturing, numerical simulation of metal manufacturing, advanced micro manufacturing, development of novel composites, and artificial intelligent applications in rolling process. He obtained his PhD from Northeastern University in 1996, and was promoted full professor at Northeastern University in 1998 and at UOW in 2010. He has over 500 publications (more than 380 journal articles) and 3 monographs in the area of advanced metal manufacturing. He has been awarded over 30 prizes and awards from Australia, Japan and China, including ARC Future Fellowship (FT3), Australian Research Fellowship (twice), Endeavour Australia Cheung Kong Research Fellowship and Japan Society for the Promotion of Science (JSPS) Invitation Fellowship. He is currently leading a highly motivated research team at UOW on rolling mechanics, advanced micro manufacturing, computational mechanics and multi-scale simulation in metal manufacturing. He also has extensive experience in managing large research projects where he is project leader. He was Deputy Director of the State Key Laboratory of Rolling Technology and Automation (1996-1998), the only State Key Laboratory in rolling and automation area in China, and has accumulated broad knowledge and extensive interdisciplinary experience through his work in Australia, Japan and China.
Title of Speech: Novel composite materials and their advanced manufacturing technologies 
Abstract: This presentation illustrates the current development of novel graphene-based composites such as SiC-graphene core-shell nanoparticles, Al2O3-SiC-GNS composite and Al alloy-SiC-GNS composite. Microstructures, wear scar-topographies and mechanical properties are analysed and evaluated in both qualitative and quantitative manner. For instance, Al/Si-SiC-graphene disks fabricated using this innovative technology have achieved a much greater hardness compared with the conventional Al/Si disks, and then demonstrates several advanced manufacturing technologies based on composite materials, including the manufacturing of micro drill using HSS and WC, micro deep drawing of Cu/Al composite and the pump body forming. Appropriate methods like theoretical analysis, numerical simulation and physical experiment have been employed to investigate these forming processes accordingly, and the material formability as well as the shape, surface quality and tribological properties of the products has also been estimated and analysed, whereof the results have proved the feasibility and efficiency of the newly developed technologies. Finally, concluding remarks are given to summarise the aforementioned contents.

 

Prof. Xin-Ping Zhang

South China University of Technology, China 

Biography: Professor Xin-Ping Zhang is currently a senior professor in South China University of Technology, and director of Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability. He obtained his BSc, MSc and PhD from Xi’an Jiaotong University in 1986, 1989 and 1993, respectively. He was appointed as lecturer and associate professor in Xi’an Jiaotong University till 1996. In 1996, he won the prestigious Alexander von Humboldt Fellowship and worked in Germany’s Berlin Technical University for two years. Then he was appointed by the University of Sydney as senior research fellow in Center for Advanced Materials Technology and concurrently an expert in CoE-DM sponsored by Australian DSTO from 1998 to 2004, and affiliated with the University of Sydney by honorary and visiting appointment from 2004 to 2013. He was specially appointed by South China University of Technology as a full professor in 2004. He won again Humboldt Fellowship (resumption) in 2006, and went to German universities for cooperation research and academic visits. He was a visiting professor in Ruhr-University Bochum in 2006 and adjunct professor of Sun Yat-Sen University from 2007 to now. Professor Zhang has published more than 350 papers (including 270+ papers in international journals and conferences), one book (313 pages, co-author), and two book chapters (120 pages). He has documented 34 patents (with 28 patents authorized and 4 transferred to industries). He has supervised 18 students with awarding PhD, 52 students with awarding MEng, and 8 post-doctors.
Speech Title:
Advances in Materials and Manufacturing Processes for Printing Flexible Electronics 
Abstract: Printed flexible electronics refer to applications of printing technologies for fabrication of various electronic devices on flexible substrates, which have attracted increasing attention in the field of wearable sensors, transparent conductive films (TCF), thin film transistors (TFT) and radio-frequency identification (RFID) tags. This invited presentation provides an overview of recent advances in research and applications of printing materials and relevant manufacturing processes used in flexible electronics.
Currently, various emerging manufacturing technologies by printing, such as ink-jet printing, screen printing, direct ink writing and gravure, have been demonstrated to be appropriate for fabrication of above flexible electronic devices. Notably, as a non-contact printing method, drop-on-demand ink-jet printing has great potential for fast and large-scale production. Meanwhile, screen printing of conductive inks is also widely used to fabricate two-dimensional (2D) electronic devices due to its low cost. Significantly, the main functional component of the inks for the above manufacturing processes is the conductive filler material, which can be metal nanomaterials, carbon nanotubes, graphene, conductive polymers and organometallic complexes. Among them, the metal nanomaterial ink with excellent conductivity is still most widely used for printing technologies.
Typically, the insulating capping agents and other additives in metallic nanoparticle inks should be removed through different post-printing treatments such as thermal sintering, photonic sintering and chemical sintering for achieving desirable physical properties. However, the damage of flexible substrate may occur due to the temperature rise caused by such sintering treatments. Thus, developing printable inks capable of sintering at low temperature is highly demanded for fabrication of flexible electronics on different flexible substrates. Additionally, the heat sensitive substrates should also be seriously considered during manufacturing processes. Furthermore, the high cost of silver and electromigration of silver atoms inevitably limit applications of silver ink in printed flexible electronics, then another major challenge is to replace silver (noble metal) ink with cheaper ones, such as copper or aluminum nanoparticles. Therefore, in order to fabricate flexible electronics with enhanced portability and reliability, the optimal selection of conductive ink materials, substrates and manufacturing processes is of great importance.